DARPA awards $840M to UT's Texas Institute for Electronics for next-gen microelectronics development for DoD.
DARPA awards $840M to UT's Texas Institute for Electronics (TIE) at The University of Texas at Austin to develop the next-gen microelectronics for the DoD. The agreement involves establishing a national open-access R&D and prototyping fabrication facility, aiming to create higher-performance, lower-power, lightweight, and compact defense systems. The investment is part of DARPA's Next-Generation Microelectronics Manufacturing program, with a total investment of $1.4B.
July 18, 2024
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