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U.S. firms seek to acquire Dutch chipmaker BESI over its key AI-related packaging tech, despite EU tensions and BESI’s stated independence.
BE Semiconductor Industries, a Dutch chip equipment maker valued at €14 billion, is drawing takeover interest from U.S. firms Lam Research and Applied Materials amid surging demand for advanced chip packaging used in AI and high-performance computing.
Morgan Stanley has advised BESI since mid-2025, with talks pausing earlier in 2026 due to U.S.-EU tensions over Greenland, though they have since resumed.
BESI’s hybrid bonding technology, which enables faster, more efficient chip connections, is seen as vital in overcoming industry bottlenecks.
The company reaffirmed its 2024 commitment to independence, but strategic interest remains high.
BESI, Morgan Stanley, and Applied Materials declined to comment; Lam Research did not respond.
Las empresas estadounidenses buscan adquirir el fabricante holandés de chips BESI por su tecnología clave de envasado relacionada con la IA, a pesar de las tensiones de la UE y la declarada independencia de BESI.