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flag UMC, HyperLight, and Wavetek launch mass production of TFLN chiplets for faster, more efficient AI and data center optics.

flag United Microelectronics Corporation (UMC), in partnership with HyperLight and Wavetek, has launched a joint effort to mass-produce thin-film lithium niobate (TFLN) chiplets for high-speed optical interconnects in AI and data center applications. flag The collaboration leverages UMC’s 8-inch wafer manufacturing and Wavetek’s 6-inch CMOS expertise to scale TFLN photonics using standardized, high-volume processes. flag The initiative aims to deliver energy-efficient, high-bandwidth optical solutions capable of supporting data rates beyond 1.6T, addressing growing demands for faster, lower-latency data transfer in AI infrastructure. flag The platform integrates short-reach, long-reach, and co-packaged optics into a single scalable architecture, accelerating TFLN’s transition from niche technology to mainstream use in cloud and networking systems.

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