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UMC, HyperLight, and Wavetek launch mass production of TFLN chiplets for faster, more efficient AI and data center optics.
United Microelectronics Corporation (UMC), in partnership with HyperLight and Wavetek, has launched a joint effort to mass-produce thin-film lithium niobate (TFLN) chiplets for high-speed optical interconnects in AI and data center applications.
The collaboration leverages UMC’s 8-inch wafer manufacturing and Wavetek’s 6-inch CMOS expertise to scale TFLN photonics using standardized, high-volume processes.
The initiative aims to deliver energy-efficient, high-bandwidth optical solutions capable of supporting data rates beyond 1.6T, addressing growing demands for faster, lower-latency data transfer in AI infrastructure.
The platform integrates short-reach, long-reach, and co-packaged optics into a single scalable architecture, accelerating TFLN’s transition from niche technology to mainstream use in cloud and networking systems.
UMC, HyperLight y Wavetek lanzan la producción en masa de chips TFLN para una IA más rápida y eficiente y una óptica de centro de datos.