Manz Asia and Epson partner to advance inkjet tech for semiconductor manufacturing, enabling precise, scalable production of advanced chip components.

Manz Asia and Epson have formed a strategic partnership to develop advanced inkjet systems for semiconductor manufacturing, combining Epson’s precision printhead technology with Manz Asia’s equipment engineering. The collaboration focuses on scalable Lab-to-Fab solutions for 2.5D/3D antenna traces, heatsinks, and bonding layers in RFIC, PMIC, and CPO devices. The joint systems enable precise printing of conductive, photoresist, and functional inks across diverse surfaces, supporting research, pilot production, and mass manufacturing. Based in Taiwan, the R&D hub fosters innovation with materials and technology partners, aiming to accelerate time-to-market and improve production efficiency. The alliance emphasizes digital additive manufacturing’s role in enabling sustainable, flexible, and high-precision semiconductor packaging.