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TECNO unveiled a prototype ultra-thin modular smartphone at MWC 2026 with magnetic, instant-upgrade modules for power, camera, and gaming.
TECNO has introduced a prototype ultra-thin modular smartphone at MWC 2026, featuring a 4.9mm-thick base device and magnetic, pogo-pin-connected modules for instant hardware upgrades.
The system supports add-ons like a 4.5mm power bank, camera, and gaming controller, using Wi-Fi, Bluetooth, and mmWave for fast, low-latency data transfer.
Two design editions, ATOM and MODA, highlight customization, with the platform designed for flexibility across photography, gaming, and off-grid use.
While still a concept, the technology aims to enable user-driven device evolution, with potential for third-party module development.
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TECNO dio a conocer un prototipo de teléfono inteligente modular ultrafino en el MWC 2026 con módulos magnéticos de actualización instantánea para energía, cámara y juegos.