FIC Global unveils advanced packaging for 800G and 1.6T optical transceivers at Singapore’s Asia Photonics Expo 2026, boosting AI-driven data center performance.

FIC Global, under its PRIME Technology brand, is showcasing advanced packaging solutions for high-speed optical transceivers at the Asia Photonics Expo 2026 in Singapore, February 4–6. The company is supporting the shift toward 800G and early 1.6T data center interconnects driven by AI, leveraging over 18 years of experience and capabilities in Flip-Chip, COB, Silicon Photonics, and Co-Packaged Optics. FICG emphasizes energy efficiency, high-speed signal engineering, and reliability to reduce qualification times and improve production stability. It is expanding manufacturing in Malaysia to enhance supply chain resilience and capacity.