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Veeco and imec created a 300mm-compatible method to integrate barium titanate into silicon photonics, boosting performance for data centers and telecom.
Veeco and imec have developed a 300mm-compatible process to integrate barium titanate onto silicon photonics, advancing the potential for high-performance, scalable photonic devices used in data centers and telecommunications.
The breakthrough enables precise deposition of barium titanate films, enhancing optical modulation and device efficiency.
The process is designed for compatibility with existing semiconductor manufacturing infrastructure, paving the way for wider adoption in next-generation optical technologies.
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Veeco e imec crearon un método compatible con 300 mm para integrar titanato de bario en fotónica de silicio, aumentando el rendimiento para centros de datos y telecomunicaciones.