Kunlunxin, Baidu’s AI chip unit, filed for a Hong Kong IPO on Jan. 1, 2026, to boost capital and support China’s semiconductor goals amid U.S. restrictions.

Kunlunxin, Baidu's AI chip unit, has confidentially filed for a Hong Kong stock exchange listing on January 1, 2026, as part of a planned spin-off to increase its visibility and capital availability. The move highlights China's push for semiconductor self-reliance in the face of US competition. Export restrictions apply to Kunlunxin, which is valued at around $3 billion and has expanded beyond Baidu's internal use to serve external clients. The filing comes after a wave of AI and chip-related IPOs in Hong Kong, which saw market activity surge in 2025, raising $36.5 billion. The final details of the offering are still pending, and the transaction is subject to regulatory approval.