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Chinese chipmaker Biren raises $624M in Hong Kong IPO amid U.S. restrictions, aiming to boost AI and semiconductor innovation despite massive losses.
Chinese chipmakers, including Biren Technology, are accelerating IPO plans in Hong Kong and Shanghai to secure funding for AI and semiconductor innovation amid U.S. export restrictions.
Biren, China’s first GPU developer to go public in Hong Kong, is raising up to $624 million with strong investor backing, though it reported a nearly $1.2 billion loss in early 2025.
The surge follows successful Shanghai listings and reflects China’s broader push for tech self-reliance, with analysts predicting Chinese chips could soon challenge global leaders like Nvidia.
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El fabricante chino de chips Biren recauda $ 624M en la OPI de Hong Kong en medio de las restricciones estadounidenses, con el objetivo de impulsar la IA y la innovación de semiconductores a pesar de las pérdidas masivas.