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Japan’s Rapidus to build second chip plant in Hokkaido by 2027–28, targeting 1.4-nm chips by 2029.
Japanese chipmaker Rapidus, backed by Sony, Toyota, IBM, and the government, plans to build a second advanced semiconductor factory in Hokkaido starting in the 2027–28 financial year, aiming to produce 1.4-nanometre chips by 2029.
The project, reported by Nikkei Asia and Hokkaido Shimbun, supports Japan’s push to strengthen domestic chip production and reduce reliance on foreign suppliers.
While Rapidus has not officially confirmed the second plant, it acknowledged media reports may be speculative and said it will announce any official plans promptly.
The facility will focus on cutting-edge chip manufacturing using single-wafer processing and in-house assembly to improve efficiency.
This effort is part of a broader strategy to compete with global leaders like TSMC, Samsung, and Intel amid rising geopolitical and technological pressures.
Rapidus de Japón construirá una segunda planta de chips en Hokkaido para el año 2027-28, con el objetivo de chips de 1,4 nm para el año 2029.