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Malaysia ranks 6th globally in semiconductor assembly, testing, and packaging, with plans to expand into high-value front-end manufacturing.
Malaysia has solidified its position as a top global hub for semiconductor assembly, testing, and packaging, ranking sixth worldwide with 13% of global capacity.
Its success stems from a decades-long, robust Machinery and Equipment (M&E) ecosystem built through foreign investments from companies like LAM Research and Applied Materials, enabling local firms to evolve into advanced engineering partners.
Supported by national strategies including the New Industrial Master Plan 2030 and the National Semiconductor Strategy, Malaysia is now expanding into higher-value front-end manufacturing.
The Malaysian Investment Development Authority (MIDA) is driving this shift by attracting global innovators, promoting technology transfer, and integrating local suppliers into global supply chains through events like SEMICON Southeast Asia 2025, aiming to transform Malaysia from a supplier base into a strategic innovation hub in the semiconductor industry.
Malasia ocupa el sexto lugar a nivel mundial en ensamblaje, prueba y embalaje de semiconductores, con planes para expandirse a la fabricación de productos de alto valor.