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Substrate, a San Francisco startup, is developing X-ray lithography chips to cut costs and boost U.S. semiconductor manufacturing, challenging ASML and TSMC.
Substrate, a San Francisco startup, has developed a chipmaking tool using X-ray lithography that could challenge ASML’s EUV systems, aiming to lower costs and support U.S. efforts to reshore semiconductor production.
Backed by $100 million from investors including In-Q-Tel and General Catalyst, the company plans to build a domestic contract manufacturing business to rival TSMC.
While still in development, its technology promises high-resolution chip fabrication at a fraction of current costs, with potential national security and economic implications if successful.
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Substrate, una startup de San Francisco, está desarrollando chips de litografía de rayos X para reducir costos e impulsar la fabricación de semiconductores en los EE. UU., desafiando a ASML y TSMC.