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WSU researchers developed flexible, durable 3D-printed antenna arrays using copper ink for reliable wireless tech in wearables, drones, and aircraft.
Washington State University researchers have created chip-sized, 3D-printed flexible antenna arrays using copper nanoparticle ink, enabling durable, lightweight wireless components that maintain performance under bending, temperature shifts, humidity, and salt exposure.
Each modular tile includes an independent processor that corrects signal errors in real time, improving reliability in dynamic environments.
The technology, funded by the Air Force Research Laboratory and other organizations, supports applications in wearables, drones, aircraft, and smart textiles, offering scalable, low-power solutions for next-generation wireless systems.
Los investigadores de WSU desarrollaron matrices de antenas impresas en 3D flexibles y duraderas utilizando tinta de cobre para una tecnología inalámbrica confiable en wearables, drones y aeronaves.