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Microsoft’s new microfluidic cooling tech slashes AI chip temps by 65%, boosting performance and efficiency.
Microsoft has developed a prototype microfluidic cooling system for AI chips that uses tiny channels etched directly onto the chip to circulate coolant, reducing peak temperatures by up to 65% compared to traditional methods.
The technology, tested at its Redmond campus, enables higher performance, safer overclocking, and more efficient data center operations by allowing chips to run hotter without throttling.
It supports advanced designs like 3D stacking and improves energy efficiency, potentially lowering grid demand and waste heat.
The system is being integrated into Microsoft’s custom AI chips, including the Maia Accelerator and Cobalt CPU, and may benefit the broader industry.
While still in development, it represents a major step toward solving AI hardware’s growing thermal challenges.
La nueva tecnología de enfriamiento microfluídico de Microsoft reduce las temperaturas de los chips de IA en un 65%, aumentando el rendimiento y la eficiencia.