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STMicroelectronics develops advanced silicon photonics tech for faster datacenter and AI interconnects.
STMicroelectronics is developing new silicon photonics and BiCMOS technologies to enhance performance and energy efficiency in datacenters and AI clusters.
These innovations will support faster optical interconnects, like 800Gb/s and 1.6Tb/s modules, starting in 2025.
The company aims to supply these advanced wafers to major tech players, as the pluggable optics market for datacenters is forecast to reach $24 billion by 2030.
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STMicroelectronics desarrolla tecnología avanzada de fotónica de silicio para interconexiones de centro de datos e IA más rápidas.