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SK Hynix receives U.S. grants and loans totaling up to $958M to build a new chip plant in Indiana.
The US Commerce Department has awarded SK Hynix, a South Korean chipmaker, a $458 million grant and up to $500 million in loans to build a new memory packaging plant and research facility in Indiana, under the CHIPS Act.
This $3.87 billion project aims to enhance the U.S. semiconductor supply chain and create around 1,000 jobs.
The facility will produce high-bandwidth memory chips crucial for AI products, with SK Hynix partnering with Purdue University and local businesses.
This move is part of broader U.S. efforts to boost domestic chip production and reduce reliance on foreign suppliers.
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SK Hynix recibe subvenciones y préstamos estadounidenses por un total de $958 millones para construir una nueva planta de chips en Indiana.