Applied Materials expands chip packaging tech to combat energy use in the AI age.

Applied Materials is expanding its EPIC innovation platform to accelerate advanced chip packaging technologies, crucial for energy-efficient computing in the AI era. The company convened industry leaders in Singapore to promote collaboration among manufacturers, suppliers, and research institutions. This move aims to address rising energy consumption due to connected devices and AI, fostering advancements in chip performance and sustainability.

November 19, 2024
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