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flag Applied Materials expands chip packaging tech to combat energy use in the AI age.

flag Applied Materials is expanding its EPIC innovation platform to accelerate advanced chip packaging technologies, crucial for energy-efficient computing in the AI era. flag The company convened industry leaders in Singapore to promote collaboration among manufacturers, suppliers, and research institutions. flag This move aims to address rising energy consumption due to connected devices and AI, fostering advancements in chip performance and sustainability.

5 months ago
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