xMEMS Labs introduces XMC-2400 µCooling chip, a vibration-based heat dissipation technology for portable electronics, set to sample in Q1 2025.

xMEMS Labs introduces the XMC-2400 µCooling chip, a fan-on-a-chip technology for smartphones, tablets and other portable electronics. The chip uses a silicon, solid-state design to vibrate airflow within its small package, dissipating heat instead of traditional spinning fans. The XMC-2400 is four times smaller and provides 16 times more airflow per volume than Frore Systems' AirJet technology. The chip is designed to cool even the smallest handheld devices, enabling thinner, high-performance AI-ready mobile devices. xMEMS Labs plans to sample the chip to interested customers in the first quarter of 2025.

August 20, 2024
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