TSMC plans to construct its first European fab in Germany, a joint project with Robert Bosch, Infineon, NXP, and ESMC, with production expected by 2027.

Taiwan Semiconductor Manufacturing Company (TSMC) plans to start construction of its first European fab in Dresden, Germany next month, with production expected by 2027. The project, known as European Semiconductor Manufacturing Company (ESMC), is a joint venture with minority stakes held by Robert Bosch GmbH, Infineon Technologies AG, and NXP Semiconductors NV, and TSMC holding a 70% stake. The facility's monthly production capacity is set to reach 40,000 300mm wafers.

July 30, 2024
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