Alphawave Semi achieves first successful 3nm UCIe Die-to-Die IP with TSMC's CoWoS in 8 Tbps/mm bandwidth.
Alphawave Semi, a high-speed connectivity leader, has announced the first successful 3nm silicon bring-up of Universal Chiplet Interconnect Express (UCIe) Die-to-Die (D2D) IP with TSMC's CoWoS advanced packaging technology. The complete PHY and Controller subsystem offers 8 Tbps/mm bandwidth density, targets hyperscaler, HPC, and AI applications, and supports multiple protocols.
July 30, 2024
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