Dutch chipmaker Besi's Q2 orders exceeded expectations at 185.2M euros, driven by demand for hybrid bonding tools, photonics, and 2.5D assembly solutions for AI.

Dutch chipmaker Besi, a supplier for semiconductor parts, reported Q2 orders of 185.2M euros ($200.74M), exceeding analysts' expectation of 179M euros. The increase is attributed to strong demand for hybrid bonding tools, photonics, and 2.5D assembly solutions for AI applications, despite weak automotive end-markets. Q1 orders were at 128M euros.