Soitec and UMC extend 11-year partnership for RF-SOI 3D IC solution supporting 5G.
Soitec and UMC extend their partnership to offer the industry's first 3D IC solution for RF-SOI technology, supporting 5G and future wireless systems. This collaboration, lasting over 11 years, aims to deliver innovative semiconductor materials for the 5G era, using vertical stacking and wafer-to-wafer bonding technology to reduce die size by 45% and integrate more RF components.
June 13, 2024
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