SK Group Chairman and TSMC Chairman discuss AI semiconductor collaboration, aiming to strengthen SK hynix's HBM leadership, with a strategic partnership focusing on HBM4 development.

SK Group Chairman Chey Tae-won met with TSMC Chairman C.C. Wei to discuss collaboration on AI semiconductors, aiming to strengthen SK hynix's position as a leading AI memory chip and high-bandwidth memory (HBM) chips maker. The two companies agreed to enhance their cooperation in the HBM sector. SK hynix had signed a strategic partnership with TSMC in April to develop HBM4, a sixth-generation HBM chip, and enhance advanced chip packaging technology capabilities.