Rapidus and IBM partner for mass production of chiplet packages in Japan's NEDO project.
Rapidus Corporation and IBM announce a joint development partnership to establish mass production technologies for chiplet packages, building on their existing collaboration for the joint development of 2nm node technology. IBM will provide packaging technology for high-performance semiconductors, with both companies working together to innovate. The partnership is part of Japan's NEDO project and aims to enhance Japan's role in the semiconductor packaging supply chain.
June 04, 2024
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