Samsung's HBM3 and HBM3E chips face heat and power issues, delaying Nvidia tests and raising concerns for Samsung's HBM market position.
Samsung's latest high-bandwidth memory (HBM) chips, HBM3 and HBM3E, are facing heat and power consumption issues, which have not yet passed Nvidia's tests, according to three sources familiar with the matter. The issues have raised concerns that Samsung may fall behind rivals SK Hynix and Micron Technology in the HBM market. Samsung has been trying to pass Nvidia's tests for HBM3 and HBM3E since last year. Despite these challenges, Samsung plans to initiate mass production of its 12-layer HBM3E products in the second quarter.
May 23, 2024
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