Toshiba completes 300-mm wafer fabrication facility for power semiconductors in Japan, marking Phase 1 of a multi-year investment program.

Toshiba has completed a new 300-mm wafer fabrication facility for power semiconductors at Kaga Toshiba Electronics Corporation in Japan. This milestone marks the start of Phase 1 of Toshiba's multi-year investment program. The facility features a seismic isolation structure, redundant power sources, and will be powered by renewable energy. Mass production is expected to begin in the second half of fiscal year 2024, increasing Toshiba's power semiconductor production capacity by 2.5 times compared to fiscal 2021.

May 23, 2024
4 Articles

Further Reading