ACM Research introduces its Frame Wafer Cleaning Tool for advanced packaging with a solvent reclamation system.

ACM Research, a leading supplier of wafer processing solutions, introduces its Frame Wafer Cleaning Tool for advanced packaging. The tool cleans semiconductor wafers during post-debonding and includes an innovative solvent reclamation system for environmental and cost benefits. ACM has successfully completed the installation and qualification of the first tool with a major Chinese manufacturer.