Japan approves $3.9B subsidies for semiconductor joint venture Rapidus with IBM, aiming to produce two-nanometer chips in Hokkaido by 2027.
Japan has approved up to $3.9 billion in subsidies for semiconductor joint venture Rapidus, as it competes with the US and Europe to attract chipmakers. Rapidus involves Japanese technology companies and US giant IBM, aiming to manufacture cutting-edge two-nanometer logic chips in Hokkaido from 2027. The subsidies will be used to buy chipmaking equipment and develop advanced back-end chipmaking processes.
April 01, 2024
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