TSMC considers building advanced packaging capacity in Japan to support Japan's semiconductor industry revival, leveraging its CoWoS technology.

Taiwan Semiconductor Manufacturing Co. (TSMC) is considering building advanced packaging capacity in Japan, supporting Japan's revival in the semiconductor industry. TSMC is considering bringing its chip on wafer on substrate (CoWoS) packaging technology, which enhances processing power, to Japan. Japan has leading semiconductor materials and equipment makers, growing chip fabrication capacity, and a strong customer base. Demand for advanced semiconductor packaging has increased globally due to the AI boom, prompting leading chipmakers like TSMC to expand their capacities.

March 17, 2024
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